Advanced Packaging Part 1 – Pad Limited Designs, Breakdown Of Economic Semiconductor Scaling, Heterogeneous Compute, and Chiplets

In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore's Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.
In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore's Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.

The growth of advanced semiconductor packaging

The growth of advanced semiconductor packaging

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advanced packaging « PRADEEP's TECHPOINTS

Abstracts listed by sessions

Advanced Packaging Part 1 – Pad Limited Designs, Breakdown Of

Advanced Packaging Part 1 – Pad Limited Designs, Breakdown Of

Four Elements of Advanced Packaging, by Suny Li, Jan, 2024

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Advanced Packaging Design for Heterogeneous Integration